Fluoroplastic restoration and transformation – From adhesive tape to domes
Liquid crystal polymer copper-clad laminates
This is a copper-clad laminate using liquid crystal polymer material. Compared to the use of fluoroplastic, the rigidity of the liquid crystal polymer substrate allows for a thinner design. The surface has excellent smoothness, making more elaborate circuitry formation possible.
Characteristics
- -High rigidity (flexural strength)
While the FL type is equal to the fluoroplastic substrate of the CGP type, the GL type has twice the flexural strength. - -Surface smoothness
With an extremely smooth surface, it is possible to support fine pitch. - -A low dielectric constant and low dissipation factor
Dielectric constant and dissipation factor are as compared with fluoroplastic substrate. - -High solder resistance.
Tested at 300℃ for 60 seconds, no abnormality occurs. - -Manufacturing.
Through Holes are not necessary, and the manufacturing process is the same as a general glass epoxy substrate.
Main uses
For use in the submillimeter wavelength range/ high frequency substrate for mobile communications equipment/ and various other uses.
General characteristics chart
| Tested characteristic | Unit | Tested conditions | Characteristic data | |
| GL type | FL type | |||
| Specific gravity | － | A | 1.43 | 1.38 |
| Line expansion coefficient | ppm/℃ | －60～150℃ | 15 | |
| Peel strength | kN/m | A | 1.0 | |
| Flexural strength | N/mm2 | A | 195 | 138 |
| Solder resistance | － | 300℃-60sec | no abnormality | |
| Water absorption rate | % | E－24/50+D－24/23 | 0.03 | |
| Volume resistivity | Ω-ｃｍ | C－96/40/90 | 1015 | |
| Surface resistance | Ω | C－96/40/90 | 1014 | |
| Insulation resistance | Ω | D－2/100 | 1012 | |
| Dielectric constant | － | circular board resonance method（11GHz） | 3.03 (Thickness：0.58mm) |
2.92 (Thickness：0.38mm) |
| Dissipation factor | － | circular board resonance method（11GHz） | 0.0025 (Thickness：0.58mm) |
0.0022 (Thickness：0.38mm) |
*Above data is measured with a substrate thickness of 0.5mm. values cannot be guaranteed.
General measurements
| Product name | thickness（mm） | size（mm） | dielectric constant | dissipation factor |
| CLP-500 FL9002 0.21t |
0.21±0.03 | 500×1200 | 2.92±0.05 | below 0.0025 |
| CLP-500 FL9002 0.38t |
0.38±0.04 | |||
| CLP-500 FL9002 0.56t |
0.56±0.05 | |||
| CLP-500 GL0002 0.40t |
0.40±0.03 | 3.02±0.05 | below 0.0030 | |
| CLP-500 GL0502 0.58t |
0.58±0.03 | 3.05±0.05 |
*dielectric constant and dissipation factor are measured at the standard value of 11GHz.
